Three technology trends in the semiconductor industry!

5G commercialization will drive the development of 5G cell phones, base stations, VR/AR devices, and emerging applications such as Industry 4.0, autonomous driving and healthcare.

5G versus 4G network, like China's high-speed railroad versus traditional ordinary railroad, high speed, low latency and large space are the distinctive features of 5G network. 3GPP has defined three major technologies and application areas for 5G mobile broadband improvement (eMBB), mainly for 3D/Ultra HD video, VR/AR and other applications; mass machine communication; (mMTC), mainly for smart wearable, smart home, smart city, Telematics, autonomous driving and medical applications. , Smart Home, Smart City, Telematics, Industrial IoT and other IoT applications; high reliability and low latency (uRLLC), mainly for critical applications with high reliability, such as autonomous driving, industrial automation and mobile healthcare. the increasing sophistication of 5G technology and the large-scale commercial deployment of 5G networks will drive the adoption of technologies such as AI, big data and cloud computing in the emerging video gaming, VR/AR, AIoT, autonomous driving, smart cities, industry 4.0 and medical imaging applications.

The trend of measurement "edge" will give more AI and measurement capabilities to edge devices, which will provide more opportunities for SoC design companies and also put forward stronger PPA requirements.

The decentralization and fragmentation of IoT application scenarios has put great pressure on transmission network bandwidth and cloud computing capabilities, forcing IoT smart terminals to have the ability to process data in place.

Third, the wafer manufacturing "heterogeneous" integrated die of different process nodes are packaged together through 2.5D/3D stacking technology, Chiplet or become the post-Moore era of chip design and manufacturing IP high-performance CPU, smartphone AP, GPU and FPGA has been the advanced process node below 14nm "Taster", TSMC's 7nm process is the current advanced mass production technology, is expected to replace it in May 2020 nm this process will become a high-end process.